Heatsinks
We offer both conventional heatsinks (extruded and stacked fin/soldered) as well as a thermosyphon variant of custom thermal modules for servers and networking switches.
Process
We have thermal assembly lines with in line re-flow soldering ovens. Thermal Test is done on line as well. For Thermosyphon, assembly is done on a CAB oven.
Simulation
We use Flowtherm and Icepak for thermal simulation.
Application
Our conventional heatsinks are used on Server & 3C application and Thermosyphon modules are targeted for high powered processors used in Cloud Computing.
